
Adding Mg, P, and other trace elements to the copper matrix gives C18665 high strength, elasticity, excellent conductivity, stress relaxation resistance, and stress corrosion resistance. C18665 can be used to manufacture materials such as automotive terminals, relay moving contacts, contact springs, busbars, circuit breakers, battery terminals, fuses, etc.
| Grade | Chemical composition(%)≤ | Thickness (mm) |
||||
| EN | GB | ASTM | Cu | Mg | P | |
| CuMgP | TMg0.5 | C18665 | ≥99.0 | 0.4-0.9 | 0.002-0.04 | 0.08-5.0 |
| Physical properties | |||||||
| Density (g/cm³) |
Modulus of elasticity (GPa) |
Thermal expansion coefficient (×10-6/K) |
Electrical conductivity (%IACS) |
Thermal conductivity W(m·K) |
|||
| 8.8 | 125 | 17.3 | 60 | 253 | |||
| Mechanical properties | Bend properties | |||||
| Temper | Hardness HV |
Tension test | 90°R/T(Thick<0.5mm) | |||
| Tensile Strength Rm/MPa |
Yield Strength MPa |
Elongation % |
Good way | Bad way | ||
| H01 | 90-140 | 365-450 | 300-410 | ≥15 | 0 | 0 |
| H02 | 120-170 | 420-510 | 370-480 | ≥10 | 0 | 0 |
| H04 | 150-190 | 480-570 | 440-550 | ≥7 | 0 | 0.5 |
| H06 | 170-210 | 540-630 | 490-620 | ≥5 | 0 | 1 |
| H08 | ≥180 | ≥590 | ≥540 | – | – | – |

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