C18665 CuMgP Copper strip

Adding Mg, P, and other trace elements to the copper matrix gives C18665 high strength, elasticity, excellent conductivity, stress relaxation resistance, and stress corrosion resistance. C18665 can be used to manufacture materials such as automotive terminals, relay moving contacts, contact springs, busbars, circuit breakers, battery terminals, fuses, etc.

Product Description

Grade Chemical composition(%)≤ Thickness
(mm)
EN GB ASTM Cu Mg P
CuMgP TMg0.5 C18665 ≥99.0 0.4-0.9 0.002-0.04 0.08-5.0
Physical properties
Density
(g/cm³)
Modulus of elasticity
(GPa)
Thermal expansion coefficient
(×10-6/K)
Electrical conductivity
(%IACS)
Thermal conductivity
W(m·K)
8.8 125 17.3 60 253
Mechanical properties Bend properties
Temper Hardness
HV
Tension test 90°R/T(Thick<0.5mm)
Tensile Strength
Rm/MPa
Yield Strength
MPa
Elongation
%
Good way Bad way
H01 90-140 365-450 300-410 ≥15 0 0
H02 120-170 420-510 370-480 ≥10 0 0
H04 150-190 480-570 440-550 ≥7 0 0.5
H06 170-210 540-630 490-620 ≥5 0 1
H08 ≥180 ≥590 ≥540

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