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C64750 is widely used in electrical connectors, semiconductor lead frames, terminals, etc. in both signal and power systems.
| Grade | Chemical composition（%） ≤ | Thickness (mm) |
||||||||
| ASTM | Cu | Fe | Zn | Ni | Si | Sn | Mg | P | Zr | |
| C64750 | Balance | 1.0 | 1.0 | 1.0-3.0 | 0.1-0.7 | 0.05-0.8 | 0.1 | 0.1 | 0.1 | 0.05-0.8 |
| Physical properties | |||||
| Density (g/cm³) |
Modulus of elasticity (GPa) |
Thermal expansion coefficient (×10-6/K) |
Electrical conductivity (%IACS) |
Thermal conductivity W(m·K) |
|
| 8.7 | 130 | 17.1 | 40 | 165 | |
| Mechanical properties | Bend properties | ||||
| Temper | Tension test | 90°R/T(Thick≤0.5mm) | |||
| Tensile Strength （MPa） |
Yield Strength (MPa） |
Elongation % （A50） |
Good way | Bad way | |
| TM00 | 590-670 | ≥520 | ≥8 | 0 | 0 |
| TM02 | 640-720 | ≥590 | ≥8 | 0 | 0 |
| TM03 | 690-780 | ≥620 | ≥6 | 0 | 0.5 |
| TM04 | 740-860 | ≥690 | ≥3 | 0.5 | 1 |
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