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By adding Ni, Si, and other trace elements to the copper matrix, C70260 exhibits high strength, excellent elasticity, conductivity, and stress relaxation resistance.
It can be used for electrified high-speed contact network components, automotive connectors, lead frames, connectors, etc.
| Grade | Chemical composition（%） | |||||
| GB | ASTM | EN | Cu | Ni | Si | P |
| BSi2-0.45 | C70260 | CuNi2Si | Balance | 1.0-3.0 | 0.2-0.7 | ≤0.01 |
| Physical properties | ||||||
| Density (g/cm³) |
Modulus of elasticity (GPa) |
Thermal expansion coefficient (×10-6/K) |
Electrical conductivity (%IACS) |
Thermal conductivity W(m·K) |
||
| 8.85 | 130 | 17 | 45 | 190 | ||
| Mechanical properties | Bend properties | |||||
| Temper | Hardness HV |
Tension test | 90°R/T(Thick＜0.5mm) | |||
| Tensile Strength Rm/MPa |
Yield Strength MPa |
Elongation % |
Good way | Bad way | ||
| TM00 | 160-210 | 585-655 | ≥450 | ≥10 | 0.0 | 0.0 |
| TM02 | 190-225 | 675-745 | ≥620 | ≥5 | 0.5 | 1.0 |
| TM03 | 200-240 | 725-830 | ≥655 | ≥2 | 1.0 | 1.5 |
| TM04 | 220-260 | 760-860 | ≥690 | ≥1 | 1.5 | 3.0 |
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