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C15500 has excellent electrical performance, thermal conductivity, and bending formability.
It is widely used in connectors, lead frames, rectifiers, high-temperature switches, and heat dissipation components for high-power integrated circuits.
| Grade | Chemical composition（%） | Thickness (mm) |
|||
| ASTM | Cu | Mg | P | Ag | |
| C15500 | ≥99.75 | 0.08-0.13 | 0.04-0.08 | 0.027-0.1 | 0.06-5.0 |
| Physical properties | |||||
| Density (g/cm³) |
Modulus of elasticity (GPa) |
Thermal expansion coefficient (×10-6/K) |
Electrical conductivity (%IACS) |
Thermal conductivity W(m·K) |
|
| 8.91 | 120 | 17.8 | 86 | 350 | |
| Mechanical properties | Bend properties | |||||
| Temper | Hardness HV |
Tension test | 90°R/T(Thick＜0.5mm) | |||
| Tensile Strength Rm/MPa |
Yield Strength MPa |
Elongation % |
Good way | Bad way | ||
| O60 | – | 235-295 | 105 | 30 | 0.0 | 0.0 |
| H02 | 90-130 | 310-380 | 260 | 13 | 0.0 | 0.0 |
| H04 | 125-145 | 385-400 | 345 | 6 | 0.0 | 0.5 |
| H06 | 140-160 | 435-495 | 385 | 5 | 0.5 | 1.0 |
| H08 | ≥135 | 450-505 | 415 | 4 | 0.5 | 1.0 |
| H10 | – | 470-515 | 435 | 3 | 1.0 | 2.0 |
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