Adding elements such as Ni, Si, Mg to the copper matrix is a typical aging strengthening alloy. C70250 has high strength, conductivity, and the precipitation of NiSi phase makes the alloy have excellent stress relaxation resistance. It can be used for automotive connectors, lead frames, elastic connectors, etc.
Grade | Chemical composition(%)≤ | Thickness (mm) |
||||||
ASTM | EN | JIS | Cu | Ni | Si | Mg | Zn | 0.05-2.0 |
C70250 | CuNi3SiMg | C7025 | Balance | 2.2-4.2 | 0.25-1.2 | 0.05-0.30 | ≤1.0 |
Physical properties | ||||||
Density (g/cm³) |
Modulus of elasticity (GPa) |
Thermal expansion coefficient (×10-6/K) |
Electrical conductivity (%IACS) |
Thermal conductivity W(m·K) |
||
8.8 | 130 | 17.6 | 45 | 190 |
Mechanical properties | Bend properties | |||||
Temper | Hardness HV |
Tension test | 90°R/T(Thick<0.5mm) | |||
Tensile Strength Rm/MPa |
Yield Strength MPa |
Elongation % |
Good way | Bad way | ||
TM00 | 180-220 | 620-760 | ≥550 | ≥14 | 0.0 | 0.0 |
TM02 | 190-240 | 655-780 | ≥585 | ≥8 | 0.5 | 0.5 |
TM03 | 210-250 | 690-810 | ≥655 | ≥7 | 1.0 | 1.0 |
TM04 | 220-270 | 760-850 | ≥720 | ≥2 | 1.5 | 1.5 |
TM06 | 250-290 | 800-880 | ≥780 | ≥1 | 2.0 | 3.0 |
TM08 | 270-330 | 840-920 | ≥810 | ≥1 | 2.5 | 3.0 |
TM10 | 300-350 | 900-1000 | ≥880 | – | 3.5 | 4.0 |
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