C70250 Copper Sheet

Adding elements such as Ni, Si, Mg to the copper matrix is a typical aging strengthening alloy. C70250 has high strength, conductivity, and the precipitation of NiSi phase makes the alloy have excellent stress relaxation resistance. It can be used for automotive connectors, lead frames, elastic connectors, etc.

Product Description

Grade Chemical composition(%)≤ Thickness
(mm)
ASTM EN JIS Cu Ni Si Mg Zn 0.05-2.0
C70250 CuNi3SiMg C7025 Balance 2.2-4.2 0.25-1.2 0.05-0.30 ≤1.0
Physical properties
Density
(g/cm³)
Modulus of elasticity
(GPa)
Thermal expansion coefficient
(×10-6/K)
Electrical conductivity
(%IACS)
Thermal conductivity
W(m·K)
8.8 130 17.6 45 190
Mechanical properties Bend properties
Temper Hardness
HV
Tension test 90°R/T(Thick<0.5mm)
Tensile Strength
Rm/MPa
Yield Strength
MPa
Elongation
%
Good way Bad way
TM00 180-220 620-760 ≥550 ≥14 0.0 0.0
TM02 190-240 655-780 ≥585 ≥8 0.5 0.5
TM03 210-250 690-810 ≥655 ≥7 1.0 1.0
TM04 220-270 760-850 ≥720 ≥2 1.5 1.5
TM06 250-290 800-880 ≥780 ≥1 2.0 3.0
TM08 270-330 840-920 ≥810 ≥1 2.5 3.0
TM10 300-350 900-1000 ≥880 3.5 4.0

 

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