C70350 is widely used in electrical connectors, semiconductor lead frames, terminals, etc. in both signal and power systems.
Grade | Chemical composition(%)≤ | Thickness (mm) |
|||||
ASTM | JIS | Cu | Ni | Si | Co | Mg | 0.08-5.0 |
C70350 | C7035 | Balance | 1.0-2.0 | 0.5-1.0 | 1.0-2.0 | ≤0.04 |
Physical properties | |||||||
Density (g/cm³) |
Modulus of elasticity (GPa) |
Thermal expansion coefficient (×10-6/K) |
Electrical conductivity (%IACS) |
Thermal conductivity W(m·K) |
|||
8.82 | 131 | – | 50 | 200 |
Mechanical properties | Bend properties | |||||
Temper | Hardness HV |
Tension test | 90°R/T(Thick<0.8mm) | |||
Tensile Strength Rm/MPa |
Yield Strength MPa |
Elongation % |
Good way | Bad way | ||
TM02 | – | 690-830 | 675-780 | ≥5 | 1.0 | 1.5 |
TM04 | 220-280 | 770-900 | 750-850 | ≥4 | 2.0 | 2.5 |
TM06 | 240-300 | 840-970 | 810-920 | ≥1 | 2.5 | 2.5 |
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