C72700 Copper-nickel-tin alloy sheet

Product Description

C72500 is widely used in electrical connectors, semiconductor lead frames, terminals, etc. in both signal and power systems. Cu Ni Sn is a modulated decomposition strengthening copper alloy, which has the advantages of high strength, high wear resistance, excellent stress relaxation resistance, and good conductivity. Widely used in the manufacturing of conductive and wear-resistant components such as bearings, bushings, bearing sleeves, high-power electronic components, precision plug-in terminals, etc.

Grade Chemical composition(%)≤ Thickness
(mm)
ASTM EN JIS Cu Ni Sn Mn Other 0.05-5.0
C72500 CuNi9Sn2 C7250 Balance 8.5-10.5 1.8-2.8 ≤0.2 ≤1.0
Physical properties
Density
(g/cm³)
Modulus of elasticity
(GPa)
Thermal expansion coefficient
(×10-6/K)
Electrical conductivity
(%IACS)
Thermal conductivity
W(m·K)
8.8 120 15 80
Mechanical properties Bend properties
Temper Hardness
HV
Tension test 90°R/T(Thick≤0.5mm)
Tensile Strength
Rm/MPa
Yield Strength
MPa
Elongation
%
Good way Bad way
TB00 100-160 350-500 195-400 ≥25
TD04 170-260 700-850 550-700 ≥6 1 1.5
TD08 240-280 850-950 670-800 ≥5 4 5
TD12 260-320 900-1050 ≥750 ≥2

FAQ

Q: How long is your delivery time?

A: Generally it is within 15 days if the goods are in stock. or it is less than 30 days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ?

A: Yes, we could offer the sample

Q: What ls your terms of payment

A.30% T/T in advance ,balance before shipment. And the price depends on the material and the quantity
If you have another question, please feel free to contact us.

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