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C1100 copper is widely used in the manufacturing of various industry products due to its excellent conductivity, thermal conductivity, and high plasticity.
Soft connection copper strip products mainly use a thickness of 0.1-0.2mm.
Terminals and connectors in the automotive industry often use a thickness of 0.3-3.0mm.
For new energy vehicle power systems and charging piles, thicknesses above 4.0mm are highly favored.
Pure electric vehicles require up to 90 kilograms of copper, while hybrid vehicles also require around 60 kilograms.
At present, we have successfully solved the cutting problem of 8.0mm thick copper strips, demonstrating the widespread application potential and processing ability of C1100 copper.
| GB | ISO | ASTM | JIS |
| TU1 | Cu-OF | C10200 | C1020 |
| T2 | Cu-RTP | C11000 | C1100 |
| TP1 | Cu-DLP | C12000 | C1201 |
| TP2 | Cu-DHP | C12200 | C1220 |
| GB | Composition(%) | ||||
| Cu | P | O | Other | ||
| TU1 | 99.97 | 0.002 | less than 0.002 | balance | |
| T2 | 99.9 | – | – | balance | |
| TP1 | 99.9 | 0.004-0.012 | – | balance | |
| TP2 | 99.9 | 0.015-0.040 | – | balance | |
| ASTM | Composition(%) | ||||
| Cu | P | O | Other | ||
| C10200 | 99.95 | 0.001-0.005 | – | balance | |
| C11000 | 99.9 | – | – | balance | |
| C12000 | 99.9 | 0.004-0.012 | – | balance | |
| C12200 | 99.9 | 0.015-0.040 | – | balance | |
| Grade（China） | Grade（Japan） | Temper | Thickness/mm | Tensile Strength Rm(N/mm2) | Elongation A1 1.3% | Hardness HV |
| T2 T3 TU1 TU2 TP1 TP2 | C1100 C1020 C1220 | O60 | more than 0.15 | no less than 195 | no less than 30 | no less than 70 |
| H01 | 215-295 | no less than 25 | 60-95 | |||
| H02 | 245-345 | no less than 8 | 80-110 | |||
| H04 | 295-395 | no less than 3 | 90-120 | |||
| H06 | no less than 350 | no less than 110 |
| Classification/um | 12 | 18 | 35 | |
| Width/mm | 520 | 520 | 520 | |
| Purity(%) | ≧99.9 | |||
| Density(g/m³) | 8.89 | |||
| Area Weight(g/㎡) | 107±3 | 160±5 | 311±6 | |
| Tensile Strength(N/㎜²) | Normal | ≧0.5 | ≧1.0 | ≧1.0 |
| 180℃30Min | ≧5 | ≧7 | ≧10 | |
| Roughness | Ra(μm) | ≦0.35 | ||
| Rz(μm) | ≦2 | |||
| Anti-oxidization | 200℃,≧90Minnondiscolouring | |||
| temperature85℃,humidity85%,nondiscolouring | ||||
| Solder Resistance | 288℃/10S no bubbles | |||
| Peel Strength(N/㎜) | ≧1.0 | ≧1.0 | ≧1.0 | |
| Surface Quality | No wrinkles, no color difference, no scratches, no convex and concave points | |||
| Storage Condition | Temperature0℃≦t≦25℃,RH≦60%,90 days | |||
| Chemical Resistance(%) | ≦5 | |||
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