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| Grade | Chemical Composition(%)≥ Microelement(%)≤ | ||||||||||||||||
| Cu | P | Ag | Bi | Sb | As | Fe | Ni | Pb | Sn | S | Zn | O | Cd | Te | Se | Mn | |
| C10100 | 99.99 | 0.0003 | 0.0004 | 0.0005 | 0.0005 | 0.0002 | |||||||||||
| TU00 | 99.99 | 0.0003 | 0.0025 | 0.0001 | 0.0004 | 0.0005 | 0.001 | 0.001 | 0.0005 | 0.0002 | 0.0015 | 0.0001 | 0.0005 | 0.0001 | 0.0002 | 0.0003 | 0.00005 |
| TU0 | 99.99 | 0.0005 | 0.0025 | 0.0005 | 0.0005 | 0.0005 | 0.001 | 0.001 | 0.0005 | 0.0005 | 0.0015 | 0.0002 | 0.0005 | 0.0005 | |||
| Physical properties | ||||
| Density (g/cm³) |
Modulus of elasticity (GPa) |
Thermal expansion coefficient (×10-6/K) |
Electrical conductivity (%IACS) |
Thermal conductivity (W/(m·K)) |
| 8.94 | 115 | 16.9 | ≥101 | 391.1 |
| Mechanical properties | ||||||||||||||
| Grade | Temper | Tensile Strength (Rm/MPa) |
Elongation (%) |
Hardness (HV) |
||||||||||
| GB | JIS | ASTM | GB | JIS | ASTM | GB | JIS | ASTM | GB | JIS | ASTM | GB | JIS | ASTM |
| TU00 | C1010 | C10100 | M | O | O61 | ≥195 | ≥195 | 200-275 | ≥30 | ≥20 | – | ≤70 | – | – |
| Y4 | 1/4H | H01 | 215-275 | 215-285 | 235-295 | ≥25 | ≥15 | 60-90 | 55-100 | |||||
| Y2 | 1/2H | H02 | 245-345 | 235-315 | 255-315 | ≥8 | ≥10 | 80-110 | 75-120 | |||||
| H | – | – | 285-345 | – | ≥80 | |||||||||
| Y | H04 | 295-380 | ≥195 | 295-360 | ≥3 | – | 90-120 | |||||||
| H06 | 215-285 | 325-385 | – | |||||||||||
| T | H08 | ≥350 | 235-315 | 345-400 | – | – | ≥110 | |||||||
| H10 | ≥275 | ≥360 | – | |||||||||||
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